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The IPCinternational standard is the most commonly used standard in the PCB circuit board production industry, and it is also a standard for PCB circuit board quality inspection. Each process is based on the IPC international standard. The content and testing included in the IPC international standard are described in detail below. project. 1
The IPC international standard is the most commonly used standard in the circuit board production industry, and it is also a standard for circuit board quality inspection. Each process is based on the IPCinternational standard. The content and testing included in the IPC international standard are described in detail below. project.
1) IPC-7525: Template DesignGuidelines. Provide guidelines for PCB the design and manufacture of solder paste and surface mount adhesive coating templates i Also discussed template design using surface mount technology, and introduced the use of through-hole or flip chip components? Technology, including overprinting, double printing and staged template design.
2) IPC-Ca-821: General requirements for thermally conductive adhesives. Including the requirements and test methods for thermally conductive dielectrics to bond components to appropriate locations.
3) IPC-M-I08: Cleaning instruction manual. Includes the latest version of IPC cleaning instructions to help manufacturing engineers when deciding on product cleaning procedures and troubleshooting. IPC-CH-65-A: Guidelines for cleaning in printed circuit board assembly #e#
4) IPC-7095: Supplement to the design and assembly process of SGA devices. Provide a variety of useful operating information for people who are using SGA devices or considering switching to the field of array packaging; provide guidance for SGA inspection and maintenance and provide reliable information about the SGA field.
5) IPC-TA-722: Welding Technology Evaluation Manual. Includes 45 articles on all aspects of soldering technology, covering general soldering, soldering materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor phase soldering and infrared soldering.
6) IPC-ESD-2020: Joint standard for the development of electrostatic discharge control procedures. Including the necessary design, establishment, implementation and maintenance of electrostatic discharge control procedures. According to the historical experience of certain military organizations and commercial organizations, it provides guidance for handling and protecting electrostatic discharge sensitive periods.
7) IPC/EIA J-STD-004: Specification requirements for flux include Appendix I. Contains technical indicators and classifications of rosin, resin, etc., organic and inorganic fluxes classified according to the content and activation degree of the halides in the flux; also includes the use of flux, substances containing flux, and low levels used in the no-clean process. Flux residue.
