Microwave Tech - Multi-layer PCB board manufacturers can quickly sample and ship

Specializing in the production of multi-layer circuit board manufacturers

Specializing in the production of thick copper circuit boards, thick copper circuit boards, precision double-sided circuit boards, impedance PCB circuit boards, blind hole circuit boards, flexible circuit boards, buried hole circuit boards, blind buried holes circuit boards, mobile phone circuit boards, Bluetooth circuit boards, Car circuit board, transportation circuit board, security circuit board, HDI circuit board, aerospace spectrograph circuit board, industrial control PCB circuit board, communication PCB circuit board, smart home PCB circuit board, military PCB circuit board, medical PCB circuit board Thick copper circuit boards with high precision and high degree of difficulty, production types: HDI mobile phone circuit boards, high frequency circuit boards, radio frequency circuit boards, impedance circuit boards, thick copper circuit boards (12OZ), soft and hard bonding boards, Yin and Yang copper boards, aluminum Substrates, hybrid boards, backplanes, buried capacitance and buried resistance boards, HDI circuit boards produced by the company, precision double-sided multilayer circuit boards, flexible circuit boards, impedance circuit boards, flexible circuit boards, and blind buried via circuit boards pass through all circuits The certificates required for board production, such as UL, SGS, ISO9001, RoHS, QS9000, TS16949, are widely used in products, such as computers, medical facilities, vehicles, various communication devices, military, aerospace, etc

Blind vias are vias that connect the surface and inner layers without penetrating the entire board. Buried vias are vias that connect the inner layers and are not visible on the surface of the finished board. For the size settings of these two types of vias, please refer to vias. . Wire hole

The definition of the minimum hole diameter of the finished plate depends on the thickness of the plate, and the plate thickness to hole ratio should be less than 5--8.
The preferred series of apertures are as follows:
Aperture: 24mil 20mil 16mil 12mil 8mil

Pad diameter: 40mil 35mil 28mil 25mil 20mil
Inner thermal pad size: 50mil 45mil 40mil 35mil 30mil
The relationship between plate thickness and minimum aperture:
Board thickness: 3.0mm 2.5mm 2.0mm 1.6mm 1.0mm
Minimum aperture: 24mil 20mil 16mil 12mil 8mil

Test hole
Test holes refer to vias used for ICT testing purposes, which can also be used as via holes. In principle, the aperture is not limited, the diameter of the pad should be no less than 25mil, and the center distance between the test holes should not be less than 50mil. Multilayer circuit board

Factors to be considered in the setting of the line width and line spacing of the blind hole board
A. The density of the veneer. The higher the density of the board, the tendency to use finer line widths and narrower gaps.
B. The current strength of the signal. When the average current of the signal is large, the current that the wiring width can carry should be considered
The width of the wire should be able to meet the electrical performance requirements and be convenient for production. Its minimum value is determined by the current size, but the minimum should not be less than 0.2mm. In the high-density, high-precision printed circuit, the wire width and The spacing is generally 0.3mm