Microwave Tech - Multilayer printed circuit board testing

The Audemars Piguet Circuit (iPCB) factory has the comprehensive manufacturing capacity of "samples-medium and small batches-large batches", and provides "high-quality, fast and satisfactory" services for domestic and foreign high-tech enterprises and scientific research units.

Multi-layer PCB circuit board copy board proofing batch production and processing manufacturers have introduced the universe full-automatic electroplating line, Hebei Baoding Landun gantry type sinking copper wire, photosynthetic LED automatic exposure machine, Han's drilling machine, American Mania AOI optical inspection machine We have cultivated a group of experienced employees and a high-quality management team, and established a complete quality assurance system.

Multi-layer PCB circuit board copy board proofing batch production processing manufacturers can process and produce double-sided, multi-layer high-precision PCB circuit boards. Products are widely used in communications, computers, industrial control, automobiles, household appliances, medical treatment, lighting, optoelectronics, instrumentation, consumer products, military industry and other fields. Customers are distributed in China, Hong Kong, Taiwan and the United States, Japan, India, Germany, Israel, Switzerland, Russia and other parts of the world.

Specializing in the production of thick copper circuit boards, thick copper circuit boards, precision double-sided circuit boards, impedance PCB circuit boards, blind hole circuit boards, flexible circuit boards, buried hole circuit boards, blind buried holes circuit boards, mobile phone circuit boards, Bluetooth circuit boards, Car circuit board, transportation circuit board, security circuit board, HDI circuit board, aerospace spectrograph circuit board, industrial control PCB circuit board, communication PCB circuit board, smart home PCB circuit board, military PCB circuit board, medical PCB circuit board Thick copper circuit boards with high precision and high degree of difficulty, production types: HDI mobile phone circuit boards, high frequency circuit boards, radio frequency circuit boards, impedance circuit boards, thick copper circuit boards (12OZ), soft and hard bonding boards, Yin and Yang copper boards, aluminum Substrates, hybrid boards, backplanes, buried capacitance and buried resistance boards, HDI circuit boards produced by the company, precision double-sided multilayer circuit boards, flexible circuit boards, impedance circuit boards, flexible circuit boards, and blind buried via circuit boards pass through all circuits The certificates required for board production, such as UL, SGS, ISO9001, RoHS, QS9000, TS16949, are widely used in products, such as computers, medical facilities, vehicles, various communication devices, military, aerospace, etc.

The inspection of the finished multilayer PCB circuit board is a very important part of the production process. The finished product inspection mainly checks whether the finished multilayer PCB circuit board has open circuit or short circuit or line over-corrosion. In most PCB circuit board manufacturers in China, Multilayer circuit board finished product testing generally needs to go through the following process: first, determine the test point set on the board according to a certain test requirement; secondly, process the test needle bed according to the test point set and drilling information (a needle bed test machine); According to the test point diagram and netlist, assemble or connect (for matrix combination test) to test the needle bed; perform electrical tests such as short circuit and open circuit on the PCB circuit board. Among them, the generation of test point sets is the key link, especially for multi-layer PCB circuit board. Previously, for single-sided, double-sided, and multi-layer boards using through-hole technology, the test point set generation has always been completed manually.

For those boards with few pads and sparse facets, it can still meet the requirements, but with With the progress of microelectronics technology, the layout density of components is getting higher and higher, and the wiring is more and more complicated. And now the life cycle of products is getting shorter and shorter. There are more tasks in small batches and multiple varieties, and time requirements are tight. Determining the unfair test point set is inefficient and error-prone, so it can no longer meet the competitive needs of fast and high-quality production