Microwave Tech - Multilayer PCB copy board method

ipcb has a professional circuit board production team and domestic leading automated production equipment. PCB products include 1-32 layer boards, high TG boards, thick copper boards, flexible and rigid boards, high frequency boards, mixed dielectric laminates, blinds Buried hole boards, metal substrates and halogen-free boards.


In fact, the four-layer board copying is repeated copying two double-sided boards, and the sixth layer is repeated copying three double-sided boards... The reason why the multi-layer board is daunting is because we cannot see the internal wiring. How do we see the inner layers of a precision multilayer board? -Stratification.

If there is a four-layer board, the components have been removed, and the surface is clean, we have to copy it into a PCB file, and proceed as follows:

1. Scan the top board, save the picture, and name it top.jpg. At this time, the scan DPI can be set according to the density, if the setting is 400DPI.
2. Scan the bottom board, save the picture, and name it

3. Grind out the middle layer 1 with coarse sandpaper, leak out the copper skin, scan the picture after cleaning it, and name it
4. Grind out the middle layer 2 with coarse sandpaper, leak out the copper skin, scan the picture after cleaning it, and name it

5. Adjust the level of each picture in PHOTOSHOP (choose to transfer the picture to ensure that the picture is level, so that the line that goes out is beautiful, and multiple pictures are easy to align up and down), here it is recommended to mirror the bottom image horizontally to make the top and bottom images The direction is the same, and the upper and lower positioning holes are the same. Finally, save each picture as a BMP file, such as: top.bmp, bottom.bmp, mid1.bmp, mid2.bmp. Note here that you don’t need to crop the picture exactly, it’s better to leave something rich, basically just adjust the picture level and you’re done.

6. Open the color copy board software, from the main menu "File" -> "Open BMP file", select the top.bmp file to open it.
7. After setting the DPI, you can copy the top layer map. First select the layer to the top layer, and then start placing components, vias, wires, etc.
8. After putting everything on the top layer, save the temporary file (both in the manual and help, you can select it through the menu or the button on the toolbar), and name it top-1.dpb (stored at different times in the middle) It is recommended to use names with different numbers, such as top-1.dpb, top-2.dpb, so as to avoid the damage of the last file due to computer failure, but the previous version of the file can be restored and reduce the loss. This is a suggestion. It depends on the individual. Like it).
9. Close the current picture window (note that only one picture can be opened at a time, never open multiple pictures).

10. From the main menu "File" -> "Open BMP File", select the bottom image bottom.bmp, and then open the temporary file top-1.dpb. At this time, you will find that the top layer drawing is not aligned with the bottom background image, press Ctrl A key combination, select all the placed primitives, press the up, down, left, right cursor keys or 2, 4, 6, 8 number keys on the keyboard to move as a whole, select several reference points and corresponding points in the background image After alignment, you can select the current layer as the bottom layer at this time, and open the bottom layer line, pad, fill, etc. What if the line on the top layer blocks the bottom layer? It's very simple. You can select "Layer Color Settings" from the "Options" in the main menu and click off the top layer. The top silk screen can also be turned off. After copying the bottom layer, save the temporary file as bottom-1.dpb, or save the PCB file as bottom-1.pcb. At this time, the file is already a two-layer aligned and combined file.

11. The copying process of the same middle layer is also the same. Repeat steps 9~10, and the final output PCB file is the PCB diagram that is exactly the same as the real thing.
Fast samples of high-precision circuit boards, 6-7 days for bulk orders for single and double panels, 9-12 days for 4-8 layers, 15-20 days for 10-16 layers, and 20 days for HDI boards. Double-sided proofing can be delivered in as fast as 8 hours.