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Millimeter wave is a very popular emerging technology in recent years. It can be used not only in 5G, but also in areas such as autonomous driving. In the theory of electromagnetics, the longer the wavelength, the longer the propagation distance, the shorter the wavelength, the closer the propagation distance, and it is easy to be blocked. The millimeter wave band is between 24GHz and 100GHz, and the speed on 5G is much higher than that of Sub-6G. Frequency band, but the propagation distance is easily limited. If it is used for autonomous driving, the detection range of millimeter waves is even more important, which is a major technical problem that needs to be solved urgently.
On February 17, at the 68th International Solid State Circuits Conference, the 38th China Electric Power Research Institute released a high-performance 77GHz millimeter wave chip and module, which was the first international realization of two three-transmit and four-receive millimeter-wave chips and 10 The single-package integration of the millimeter wave antenna provides a detection distance of 38.5 meters, setting a new record for the longest detection distance of a millimeter wave package antenna in the world.
The packaged antenna module released this time contains two 38 self-developed 77GHz millimeter-wave radar chips, which are oriented to the core millimeter-wave sensor requirements in the field of intelligent driving, using low-cost CMOS (complementary metal oxide semiconductor technology), monolithic integration 3 transmitting channels, 4 receiving channels and radar waveform generation, etc. The main performance indicators have reached the international advanced level, and it has special advantages in fast broadband radar signal generation. The chip supports multi-chip cascade and builds a larger-scale radar array.
According to experts, this millimeter-wave radar chip realizes the function of multi-channel millimeter-wave radar transceiver front-end in a 24mm*24mm space, creatively proposes a dynamically adjustable fast broadband chirp signal generation method, and uses multiple feeds in the package. Incoming antenna technology greatly increases the effective radiation distance of the packaged antenna, and provides a small size and low-cost solution for short-distance intelligent sensing. It is expected to drive another breakthrough in the field of intelligent sensing technology.
The packaging antenna technology takes into account antenna performance, cost and volume, and represents a major achievement in millimeter wave antenna technology in recent years. Fan-out wafer-level packaging is a mainstream approach to package antennas. Large international companies have developed chip products with integrated package antennas based on this technology. The team from the 38th Institute of Electronics Technology of China is based on fan-out wafers. Class-level packaging technology, creatively adopting multi-feed antenna technology, effectively improved the problem of low efficiency of the packaging antenna, and achieved a new world record for the detection distance.
In the next step, the 38th Research Institute of Electronics Technology of China will further optimize the millimeter-wave radar chip and change it according to the expansion of application requirements and technological progress, and provide one-stop solutions according to specific application scenarios.
The International Solid-State Circuits Conference was initiated by Bell Labs and other institutions that invented the transistor in 1953. It is usually the first place where the most advanced solid-state circuit technology in the world was published in various periods. It is considered an "Olympic event" in the field of integrated circuits. In more than 60 years of history, many milestone inventions in the history of integrated circuits made their debut here. For example: the world's first TTL circuit, the world's first GHz microprocessor, the world's first CMOS millimeter wave circuit and so on. The scientific research results selected for this conference represent the highest technological level in the current international integrated circuit field.
