Model : 4L 1+N+1 Wifi Module PCB
Material:FR-4
Layer :4L 1+N+1 HDI
Color :Black /White
Finished Thickness:0.8mm
Copper Thickness :inner1OZ outer0.5OZ
Surface Treatment :Immersion Gold+OSP
Min Trace / Space :3mil/3mil
Min Hole :Mechanical hole 0.2mm,Laser Hole 0.1mm
Application : wifi module pcb
Specail Process: Half hole package edge.
WiFi modules can be divided into three categories:
1. General Wi Fi modules, such as mobile phones, laptops, and tablets
The USB or SDIO interface module, Wi Fi protocol stack and driver run in Android, windows and IOS systems, and need a very powerful CPU to complete the application;
2. Wi Fi module is a typical home router. The protocol and driver are based on the chip with powerful flash and ram resources and Linux operating system;
3. Embedded Wi Fi module, 32-bit single chip microcomputer, built-in Wi Fi driver and protocol, interface for general MCU interface such as UART. Suitable for all kinds of smart home or smart hardware products.
Many manufacturers have tried to add Wi Fi module into TV, air conditioning and other equipment to build wireless home intelligent system. To realize the control of app and the connection with internet giants such as Alibaba cloud, JD cloud and Baidu cloud, the home appliance manufacturers can quickly and conveniently realize the network intelligence of their products and realize the interconnection with more other appliances.
Application
Serial port (RS232 / RS485) to WiFi, TTL to WiFi;
WiFi monitoring, TCP / IP and Wi Fi coprocessor;
WiFi remote control aircraft, cars and other toy fields;
WiFi network radio, camera, digital photo frame;
Medical instruments, data acquisition, handheld devices;
WiFi fat scale, smart card terminal; home intelligent;
Instrument, equipment parameter monitoring, wireless POS machine;
Other wireless related secondary development and application in modern agriculture and military fields
Model : 4L 1+N+1 Wifi Module PCB
Material:FR-4
Layer :4L 1+N+1 HDI
Color :Black /White
Finished Thickness:0.8mm
Copper Thickness :inner1OZ outer0.5OZ
Surface Treatment :Immersion Gold+OSP
Min Trace / Space :3mil/3mil
Min Hole :Mechanical hole 0.2mm,Laser Hole 0.1mm
Application : wifi module pcb
Specail Process: Half hole package edge.
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