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This is a pre g used in high-frequency multi-layer PCB, with DK=2.25 DF=0.0015 for F4-PP220 at a frequency of 10GHz.
Features of F4-PP220
1. F4-PP220 has a low dielectric constant, low dielectric loss, thermosetting resin film, and does not contain fiberglass cloth. Therefore, it has excellent frequency stability and can be used for millimeter wave and radar.
2. It has excellent heat resistance and can withstand 3 times of reflow soldering without layering or foaming.
3. F4-PP220 has excellent adhesion with substrate and copper foil. It can have good adhesion with FR4 sheet, PTFE sheet, PI sheet, high-speed sheet, and various copper foils. Even when combined with single-sided LCP copper-clad plate, it can still perform well.
4. Without the need for a high-temperature press, the PCB ordinary vacuum press can be used to complete the pressing: the pressing temperature is 160~170 ℃, the time is 60~90 minutes, the pressure is 2.8~3.8MPA, and it can withstand multiple pressing. It can be used by pressing at 165 ℃, 3.8MPA.
5. When F4-PP220 is pressed, there is basically no glue flow.
6. It is halogen-free and environmentally friendly, with UL94-V0 equivalent performance.
Prepreg Dk = 2.2 F4-PP220
