Tecnología de PCB - Versión completa del proceso de producción de PCB

Versión completa del proceso de producción de Placa de circuito impreso

Hoy te traje la versión completa de Placa de circuito impreso Proceso de producción, Espero que aprendas más. Placa de circuito impreso Producción!

Placa de circuito impreso--Cut Lamination

Objective: according to the requirements of the engineering data MI, the large sheet meeting the requirements is cut into small pieces of production sheet and small pieces to meet the requirements of customers

Proceso: large board cutting according to MI requirements

Placa de circuito impreso--Drill hole

Objective: according to the engineering data, drill the required hole diameter at the corresponding position on the plate with the required size

Process: lamination - put on board - drilling - put off board - inspection / Reparación

Placa de circuito impreso--PTH

Objective: to deposit a thin layer of copper on the wall of insulating hole by chemical method

Process: rough grinding - hanging plate - automatic copper sinking line - lower plate - dilute H2SO4 - increase copper

Placa de circuito impreso--Dry film

Objective: graphic transfer is to transfer the image on the production Película a la Junta

Process: (solder mask process): board grinding - printing the first side - drying - printing the second side - drying - exposure - developing - inspection（ Dry film process: pressing film - standing - alignment - exposure - standing - developing - inspection）

Placa de circuito impreso--Etching

Objective: etching is to use chemical reaction method to remove the copper layer of non circuit parts

Placa de circuito impreso--Solder mask

Objective: solder mask is to transfer the graphics of green ink, film to the board, so as to protect the circuit and prevent the tin on the circuit when welding parts

Process: grinding plate - printing photosensitive green oil - curium plate - exposure - development; board grinding - printing the first side - drying plate - printing the second side - drying plate

Placa de circuito impreso--Silk screen

Objective: silk screen is a kind of mark which is easy to identify

Process: solder mask after final curium - cooling and standing - screen adjustment - character printing - back curium

Placa de circuito impreso--Surface treament

Objective: to coat a nickel / Una capa de oro con el espesor requerido en el dedo de inserción, so as to make it have more hardness and wear resistance

Process: grinding board - degreasing - twice water washing - micro erosion - twice water washing - pickling - copper plating - water washing - nickel board - washing - gold plating

Placa de circuito impreso--Outline

Objective: through the mold stamping or CNC Gong machine gongs out of the customer needs the shape forming method, Gong orgánico, Tabla de cerveza, gongs, hand cut

Note: the accuracy of data gong machine board and beer board is higher than that of hand Gong, Las tablas de cortar hechas a mano sólo pueden hacer algunas formas simples

Placa de circuito impreso--Test

Objective: to detect the open circuit, short circuit and other defects that are difficult to find by visual inspection

Process: mold loading - board setting - test - qualified - FQC visual inspection - unqualified - repair - return to test - OK - reject - scrap

Placa de circuito impreso--Final inspection

Objective: through 100% visual inspection of plate appearance defects, Y reparar pequeños defectos, to avoid problems and defective plate outflow

Specific work process: incoming materials - check data - visual inspection - qualified - FQA spot check - qualified - packaging - unqualified - treatment - check -OK

So, Lo anterior es sobre el proceso completo Placa de circuito impreso, Si tiene alguna otra sugerencia, IPlaca de circuito impreso Bienvenido a comunicarse con usted.

Proceso de Placa de circuito impreso