Технология PCB - преимущества и недостатки FPC

1 Disadvantages of FPC:


(1) High initial cost at one time
Since soft PCB is designed and manufactured for special application, стоимость проектирования схемы, wiring and photographic plate is high. Использовать & мягкий PCB, it is better not to use it in a small amount of applications.


(2) It is difficult to change and repair soft PCB
Once the soft PCB is made, изменения должны начинаться с основной диаграммы или программы, Поэтому изменить нелегко. Its surface is covered with a layer of protective film, Необходимо демонтировать перед ремонтом и после ремонта восстановить, which is a relatively difficult work.


(3) Limited size
Soft PCB is usually manufactured by batch process, Поэтому из - за размера производственного оборудования он не может быть изготовлен достаточно широко.


(4) Improper operation is easy to damage
Improper operation of the assembly personnel may cause damage to the soft circuit

2 Advantages of FPC:
Flexible printed circuit board (FPCB) is a kind of printed circuit board made of flexible insulating substrate. It has many advantages that hard printed circuit board does not have


(1) It can be bent, свободно наматывать и складывать, arranged according to the spatial layout requirements, и можно свободно перемещаться и растягиваться в трёхмерном пространстве, so as to achieve the integration of component assembly and wire connection;


(2) The volume and weight of electronic products can be greatly reduced by using FPC, пригодность электронной продукции для развития в направлении высокой плотности, miniaturization and high reliability. поэтому, FPC has been widely used in aerospace, военный, mobile communications, портативная вычислительная машина, computer peripherals, корманный компьютер, digital cameras and other fields or products;


(3) FPC also has the advantages of good heat dissipation and solderability, лёгкая сборка, низкая комплексная себестоимость. The design of the combination of soft and hard also makes up for the slight deficiency of flexible substrate in the bearing capacity of components to a certain extent.