Новости PCB - Шэньчжэнь SMT

Shenzhen SMT patch process introduction
сейчас, растущие требования государства к охране окружающей среды и усиление управления. This is a challenge but also an opportunity for печатная плата завод. If печатная плата завод полон решимости решить проблему загрязнения окружающей среды, then FPC продукты гибких схем могут идти в переднем крае рынка, и печатная плата завод can get opportunities for further development.
эпоха Интернета нарушила традиционный маркетинг, and a large number of resources have been gathered together to the greatest extent through the Internet, это тоже ускорилось. FPC flexible circuit boards, Затем с ускорением темпов развития, environmental problems will continue to appear in печатная плата factories. In front of him. Однако, with the development of the Internet, стремительное развитие событий в области охраны окружающей среды и информатизации окружающей среды. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields.
Basic process: template (steel mesh)---screen printing---mounting---reflow soldering---cleaning---inspection---rework---packaging

1. SMT process flow-------single-side assembly process
Incoming material inspection --> Screen printing solder paste (point patch glue) --> SMT --> Drying (curing) --> Reflow soldering --> Cleaning --> Inspection --> Rework
Two, SMT process ------ single-sided mixed process
Incoming material inspection --> печатная плата A-side silk screen solder paste (point patch glue) --> SMT --> Drying (curing) --> Reflow soldering --> Cleaning --> Plug-in --> Wave soldering --> Cleaning --> Inspection --> Repair

Three, SMT process ------ double-sided assembly process
A: Incoming inspection --> печатная плата A side silk screen solder paste (point patch glue) --> SMT --> Drying (curing) --> A side reflow soldering
--> Cleaning --> Flip board --> печатная плата's B-side silk screen solder paste (point patch glue) --> SMT --> Drying --> Reflow soldering (preferably only for
Side B --> Cleaning --> Inspection --> Rework) This process is suitable for mounting large SMDs such as PLCC on both sides of the печатная плата.
B: Incoming inspection --> печатная плата's A side silk screen solder paste (point patch glue) --> SMD --> drying (curing) --> A side reflow soldering
--> Cleaning --> Turnover --> печатная плата's B-side patch adhesive --> SMD --> Curing --> B-side wave soldering --> Cleaning --> Inspection
--> Rework) This process is suitable for reflow soldering on the A side of the печатная плата сварка гребнем волны. Among the SMD assembled on the B side of the печатная плата, there are only SOT or SOIC
(28) This process should be used when the lead is below.
Four, SMT process ------ double-sided mixed packaging process
A: Incoming inspection --> печатная плата's B side patch glue --> SMD --> curing --> flip board --> печатная плата A side plug-in --> wave soldering
--> Cleaning --> Inspection --> Rework, Вставить сначала, suitable for the situation where there are more SMD components than separate components
B: Incoming inspection --> печатная плата A side plug-in (pin bend) --> Flip board -->печатная плата B side point patch glue --> SMD --> curing
--> Flip board --> Wave soldering --> Cleaning --> Inspection --> Rework
SMT processing technology includes many aspects, техника проектирования и изготовления электронных элементов и интегральных схем, техника проектирования схем электронной продукции,
техника проектирования и изготовления автоматов, development and production technology of auxiliary materials used in assembly manufacturing, техника защиты электронов от статического электричества, etc.,
поэтому, the production of a complete, красивый, and well-tested electronic product will be affected by many factors.
характеристика оборудования для монтажа поверхности. Surface mount technology (SMT) is a new generation of electronic assembly technology. At present, most high-end electronic products in China are common
SMT mounting technology is used all over the world. с развитием электронной техники, surface mounting technology will be an inevitable trend in the electronics industry. Шэньчжэнь занимает лидирующее место в китае.
It is also in the front.
использование заплатки печатная плата, automatic plug-in machine AI, сварочный автомат, etc., машина заменила рабочую силу, Это тенденция.