Новости PCB - завод по производству пластин рассказал вам немного знаний о микросрезах для изготовления остатков клея

Circuit board factories are production-oriented manufacturers, а качество продукции всегда было в центре внимания производителя. The following editor wants to share with you the little knowledge of завод платы удаление шлака.

The circuit board factory tells you the little knowledge of micro-slicing making glue residue

Because the Tg of FR-4 epoxy resin is about 130 degrees Celsius, в процессе бурения температура, создаваемая интенсивным трением между иглой и тарелкой, очень высока, and because glass fiber resin and tungsten carbide (Tungsten Carbide) are both poor conductors, накапливаемое тепло обычно приводит к мгновенной температуре стенки отверстия выше 200°C, which inevitably makes part of the resin soften and become glue. вращаться по спирали, the hole wall is covered, и боковая медная поверхность каждого внутреннего отверстия не может быть иммунизирована. After cooling, Это пятно, which forms the obstacle of the "Interconnection" between the ring and the copper wall. Это хорошо известно в бизнесе., and it is caused by Smear. в глазах меджея Производители платы, the "Separation" cannot contain sand. качество - твердая истина. Конечно, Производители платы will pay attention to these problems. удаление шерсти для обеспечения качества.

The circuit board factory tells you the little knowledge of micro-slicing making glue residue

The slag removal process has been valued by Производители платы за десятилетия, and domestic manufacturers have a lot of mass production experience in this area. Однако, taking the motherboard as an example, в среднем 5,000 holes are drilled for each chip, and it is inevitable that there will be occasional errors during the connection processing of the wet process of the large row of PCB boards. Wet or chemical oxidation method is used to remove the scum on the hole wall. From the early concentrated sulfuric acid method and dichromic acid method to the current "bulking + potassium permanganate" method, можно сказать, что после многих лет обучения все формулы сыграли свою роль, the current analysis and control technology has also found a direction, То есть, to closely monitor the bath liquid, and immediately replace the bath liquid to ensure the due yield before it is about to fail. такой, there are not many real glue residue failures, наш Производители платы can also rest assured.