Новости PCB - Смотри! технология обработки PCBA

Quick look! PCBA процессing процесс

Printed circuit boards, various integrated circuits and electronic components are the working raw materials of theпроизводство полихлорированных дифениловнитка. These raw materials can accurately place the integrated circuits and electronic components we need through the production line and weld them on the printed circuit board to become computers, цветное телевидение, The основная платасвязно - аппаратный. And the main content of this article is to introduce the обработка PCBAпроцесс для читателей, so that you in front of the screen will have a simple but specific understanding of the main steps of the обработка PCBAprocess, let's take a look!

The first step: solder paste printing
The squeegee advances the solder paste along the surface of the template. When the solder paste reaches an opening area of the template, давление вниз, оказываемое скребком, вынуждает сварную пасту пройти через открытую область опалубки и упасть на схемную пластину.

Step 2: Apply adhesive
Optional process. для того чтобы предотвратить расплавление и падение компонентов большой интегральной схемы в нижней части при монтаже нижней поверхности или при двухсторонней обратной сварке, the double-sided assembly circuit board needs to be glued to the component.

Этап 3: размещение компонентов

This process is to use an automated placement machine to pick up the surface mount components from the feeder and accurately mount them on the printed circuit board.

Step 4: Inspection before and after welding
Before the components are reflow soldered, it is necessary to carefully check whether the components are well mounted and whether the position is offset or not.

Step 5: Reflow soldering
After the component is placed on the solder, the solder on the pad is melted by the flow soldering process of thermal convection technology to form the mechanical and electrical interconnection between the component lead and the pad.

The sixth step: component insertion
For through-hole plug-in components and surface-mount components that cannot be mounted on certain machines, встроенный электролитический конденсатор, connectors, кнопочный выключатель, and metal terminal electrode components (MELF), Вставка компонентов вручную или использование автоматической вставки.

Step 7: Wave soldering
Wave soldering is mainly used to solder through-hole plug-in components.

Step 8: Cleaning
Step 9: Repair
This is an off-line process whose purpose is to economically repair defective solder joints or replace defective components.
Step 10: Electrical test
Electrical testing mainly includes online testing and functional testing.
Step 11: Quality Management
Quality management includes quality control in the production line and product quality assurance before delivery to customers.
The twelfth step: packaging and sampling inspection
The last step is to pack the components and conduct sampling inspections after packaging to again ensure the high quality of the products that will be delivered to customers.

Основная панель является ядром научно - технической электроники, and the normal operation of all functions is closely related to it. Это просто описание обработка PCBAprocess. If it is to be subdivided and expanded, этот процесс не так прост. надеюсь, эта статья поможет вам понять процесс PCBA, and it can also uncover more mysteries about PCBA.