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F4BTME-1/2 is laminated by laying up of the imported varnished glass cloth with Teflon PCB resin and filler with the Nano-ceramic membrane, according to the scientific formulation and strict technology process. The low roughness copper foil adopted. This product takes advantages over F4BM-2-A series in the electrical performance, improved the heat dissipation and have the small thermal expansion coefficient. PIM stability,applicable for the communication of 4G and 5G.
F4BTME-1/2 Technical Specifications
Appearance | Meet the specification requirements for the laminate of microwave PCB by National and Military Standards. | |||||||||||||||
Types | F4BTME-1/2 (255) | F4BTME-1/2 (265) | F4BTME-1/2 (285) | F4BTME-1/2 (294) | F4BTME-1/2 (300) | F4BTME-1/2 (320) | ||||||||||
F4BTME-1/2 (338) | F4BTME-1/2 (350) | F4BTME-1/2 (400) | F4BTME-1/2 (440) | |||||||||||||
Dimension(mm) | 610*460 | 600*500 | 1220*914 | 1220*1000 | 1500*1000 | |||||||||||
For special dimension,customized laminates is available. | ||||||||||||||||
Thickness and Tolerance(mm) | Laminate thickness | 0.254 | 0.508 | 0.762 | 0.787 | 1.016 | ||||||||||
Tolerance | ±0.025 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | |||||||||||
Laminate thickness | 1.27 | 1.524 | 2.0 | 3.0 | 4.0 | |||||||||||
Tolerance | ±0.05 | ±0.05 | ±0.075 | ±0.09 | ±0.1 | |||||||||||
Laminate thickness | 5.0 | 6.0 | 9.0 | 10.0 | 12.0 | |||||||||||
Tolerance | ±0.1 | ±0.12 | ±0.18 | ±0.18 | ±0.2 | |||||||||||
Mechanical Strength | Cutting/punching Strength | Thickness1mm,no burrs after cutting,minimum space between two punching holes is 0.55mm,no delamination. | ||||||||||||||
Thickness1mm,no burrs after cutting,minimum space between two punching holes is 1.10mm,no delamination. | ||||||||||||||||
Peel strength(1oz copper) | Normal state:≥16N/cm;No bubble, delamination, peel strength≥14N/cm(in the constant humidity and temperature, and keep in the melting solder of 265 degree Celsius±2 degree Celsius for 20 seconds). | |||||||||||||||
Thermal stress | After solder float,260ºC,10s,≥3 times,no delamination and blister. | |||||||||||||||
Chemical Property | According to the properties of laminate,the chemical etching method for PCB can be used. The dielectric properties of laminate are not changed. The plating through hole can be done,but the sodium treatment or the plasma treatment must be used. | |||||||||||||||
Electrical Property | Name | Test condition | Unit | Value | ||||||||||||
Density | Normal state | g/ cm3 | 2.1～2.8 | |||||||||||||
Moisture Absorption | Dip in the distilled water of 20±2 degree Celsius for24 hours | % | ≤0.05 | |||||||||||||
Operating Temperature | High-low temperature chamber | degree Celsius | -50 degree Celsius～+260 degree Celsius | |||||||||||||
Thermal Conductivity | W/m/k | 0.6~0.9 | ||||||||||||||
CTE (typical) | -55～288 degree Celsius (εr :2.55~3.0) | ppm/ degree Celsius | 15(x) | |||||||||||||
15(y) | ||||||||||||||||
65(z) | ||||||||||||||||
CTE (typical) | -55～288 degree Celsius (εr :3.2~3.5) | ppm/ degree Celsius | 15(x) | |||||||||||||
15(y) | ||||||||||||||||
55(z) | ||||||||||||||||
CTE (typical) | -55～288 degree Celsius (εr :4.0~4.4) | ppm/ degree Celsius | 12(x) | |||||||||||||
14(y) | ||||||||||||||||
50(z) | ||||||||||||||||
Shrinkage Factor | 2 hours in boiling water | % | 0.0002 | |||||||||||||
Surface Resistivity | 500V DC | Normal state | M·Ω | ≥1*106 | ||||||||||||
Constant humidity and temperature | ≥1*105 | |||||||||||||||
Volume Resistivity | Normal state | MΩ.cm | ≥1*107 | |||||||||||||
Constant humidity and temperature | ≥1*106 | |||||||||||||||
Surface dielectric strength | Normal state | d=1mm(Kv/mm) | ≥1.2 | |||||||||||||
Constant humidity and temperature | ≥1.1 | |||||||||||||||
Dielectric Constant | 10GHZ | εr | 2.85±0.05, 2.94±0.05 3.00±0.05, 3.20±0.05 3.38±0.05, 3.50±0.05 4.00±0.08, 4.40±0.1 | |||||||||||||
Thermal Coefficient ofεr (PPM/ degree Celsius) -50150 degree Celsius | εr | Value | ||||||||||||||
2.85,2.94 | -85 | |||||||||||||||
3.0,3.2 | -75 | |||||||||||||||
3.38 | -65 | |||||||||||||||
3.5 | -60 | |||||||||||||||
4.0 | -60 | |||||||||||||||
4.4 | -60 | |||||||||||||||
Dissipation Factor | 10GHZ | tgδ | 2.553.0 | ≤1.5*10-3 | ||||||||||||
tgδ | 3.03.5 | ≤2.0*10-3 | ||||||||||||||
tgδ | 4.04.4 | ≤2.5*10-3 | ||||||||||||||
PIMD | 2.5 GHZ | dbc | -163 | |||||||||||||
UL Flammability Rating | 94 V-0 | |||||||||||||||
