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PCB Material List

PCB Material List - F4BT-1/2 PTFE woven glass fabric copper clad laminates with ceramic filled

PCB Material List

PCB Material List - F4BT-1/2 PTFE woven glass fabric copper clad laminates with ceramic filled

F4BT-1/2 PTFE woven glass fabric copper clad laminates with ceramic filled

F4BT-1/2 is a micro dispersed ceramic PTFE composite with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. This product have higher dielectric constant than the traditional PTFE copper clad laminates to meet the design and manufacturing of circuit miniaturization. Due to filling with the ceramic powder.


F4BT-1/2 have a low Z axis coefficient of thermal expansion ensures excellent reliability of plated through-holes. Besides,because of the high thermal conductivity,advantage to the heat dissipation of apparatus.


F4BT-1/2 Technical Specifications

Appearance

Meet the specification requirements for microwave PCB baseplate by National and Military Standards.

Types

F4BT294

F4BT600

Dielectric Constant

2.94

6.0

Dimension(mm)

500*600 430*430

Thickness and Tolerance(mm)

Plate thickness

0.25

0.5

0.8

1.0

Tolerance

±0.02~±0.04

Plate thickness

1.5

2.0

3.0

4.0

Tolerance

±0.05~±0.07

Plate thickness includes the copper thickness. For special dimension,customized laminates is available

Mechanical Strength

Warp

Plate thickness(mm)

Maximum Warp

Single side

Double side

0.25~0.5

0.050

0.025

0.8~1.0

0.030

0.020

1.5~2.0

0.025

0.015

3.0

0.02

0.010

Cutting/punching

Strength

Thickness < 1mm,no burrs after cutting,minimum space between two punching holes is 0.55mm,no delamination.

Thickness > 1mm,no burrs after cutting,minimum space between two punching holes is 1.10mm,no delamination.

Peel strength

Normal state:≥17N/cm,After thermal stress:≥14 N/cm

Chemical Property

According to different properties of baseplates,the chemical etching method for PCB can be used. The dielectric properties of baseplates are not changed. The plating through hole can be done. The Hot Air Level temperature can not be higher than 263 degree Celsius,and can not repeated.

Electrical Property

Name

Test condition

Unit

Value

Density

Normal state

g/ cm3

2.3~2.6

Moisture Absorption

Dip in the distilled water of 20±2 degree Celsius for24 hours

%

≤0.02

Operating Temperature

High-low temperature chamber

degree Celsius

-50 degree Celsius~+260 degree Celsius

Thermal Conductivity


W/m/k

0.4

CTE

0~100 degree Celsius

ppm/ degree Celsius

20(x)

25(y)

140(z)

Shrinkage Factor

2 hours in boiling water

%

0.0002

Surface Resistivity


M·Ω

≥1*104

Volume Resistivity

Normal state

MΩ.cm

≥1*105

Constant humidity and temperature

≥1*104

Pin Resistance

500VDC

Normal state

≥1*105

Constant humidity and temperature

≥1*104

Dielectric Breakdown


kv

≥20

Dielectric Constant

10GHZ

εr

2.94,6.0(±2%)

Dissipation Factor

10GHZ

tgδ

≤1*10-3