Новости PCB - HDI определяет HDI

HDI defines HDI: short for high Density interconnection, высокоплотное межсоединение, non-mechanical drilling, малослепое кольцо, inner and outer layer wiring line width/расстояние между линиями меньше 4миля, есть pad diameter is not greater than 0.три5mm The build-up multi-layer boardmanufacturing method is called панель HDI.

Blind via: the abbreviation of Blind via, соединение внутри и снаружи. Buried via: the abbreviation of Buried via, Она реализует связь и передачу между внутренним и внутренним слоем. The blind hole is mostly 0.диаметр 05mm ~ 0.15mm отверстие, buried blind holes have laser hole formation, плазменная кавитация и формирование фотокавитации, usually laser hole formation, and laser hole formation is divided into CO2 and YAG ultraviolet laser (UV).

2. панель HDI материал. панель HDI material has RCC, Либеральная партия, FR41) RCC: Resin coated copper abbreviation, медная фольга с смоляным покрытием. RCC is composed of copper foil and resin whose surface has been roughened, жаростойкий, anti-oxidation, сорт., and its structure is shown in the following figure: (Used when thickness> 4mil) RCC resin layer, with FR-4 bonding sheet (Prepreg) Same processability. Кроме того, it is necessary to meet the relevant performance requirements of the build-up method multi-layer board, such as:

(1) High insulation reliability and microvia reliability;

(2) High glass transition temperature (Tg);

(3) Low dielectric constant and low water absorption;

(4) It has higher adhesion and strength to copper foil;

(5) The thickness of the insulating layer after curing is uniform and at the same time, Потому что RCC - это новый продукт без стекловолокна, it is conducive to laser and plasma etching treatment, Он помогает уменьшить вес кожи и утонуть многослойная плита.

In addition, медная фольга с смолистым покрытием имеет тонкую медную фольгу, например, 12pm и 18pm., which is easy to process. 2) LDPE: 3) FR4 sheet material: used when the thickness is <=4mil. When using PP, Общее использование 1080, and try not to use 2116 PP2. требования медной фольги: когда клиент не нужен, the copper foil on the substrate is preferably 1 OZ in the traditional PCB inner layer, and the панель HDI is preferably HOZ, медная фольга для гальванизации изнутри/3 OZ first.

3. Laser hole formation: CO2 and YAG UV laser hole formation The principle of laser hole formation: laser light is a powerful beam of light that is excited when the "ray" is stimulated by external sources, энергия инфракрасного или видимого света., UV light has another chemical energy. когда он коснулся поверхности работы, there will be three phenomena of reflection (Refliction), absorption (Absorption) and penetration (Transmission), только абсорбируемый эффект. And its effect on the plate is divided into two different reactions: photothermal ablation and photochemical cracking. 1. YAG's UV laser hole formation: It can gather tiny beams, Относительно высокая абсорбция медной фольги. It can remove the copper foil and can be burned to micro blind holes below 4mil. перфорация с помощью лазера CO2, resin will remain at the bottom of the hole. на дне отверстия практически нет остатков смолы, но легко повредить медную фольгу на дне отверстия. The energy of a single pulse is small and the processing efficiency is low. (YAG, ультрафиолетовые лучи: длина волны 355, the wavelength is quite short, Он может обрабатывать очень маленькие отверстия, which can be absorbed by resin and copper at the same time) No special windowing process is required. 2. CO2 laser hole formation: using infrared CO2 laser machine, углекислый газ не может быть поглощен медью, Но абсорбирующая смола и стеклянное волокно, generally слепое отверстие 4 - 6 мм.

The hole forming method is as follows:

A. The Conformal Mask method of opening the copper window is to first press the RCC on the inner core board, затем откройте медное окно, Затем с помощью лазера сожги основную часть окна, закончите микрослепое отверстие. The details are to first make the inner core board of FR-4, черная цепь и арочный для точечной сварки по обеим сторонам, and then press it, затем по медной травильной пленке удаляется соответствующая медная оболочка, удаляется положение слепой дыры и используется смола в лазерном окне сжигания СО2., нижняя прокладка может копать, образуя микрослепое отверстие. (The size of the copper window is the same as the blind hole.) This method was originally a patent of "Hitachi," and the general industry may have to be careful of legal issues when shipping to the Japanese market.

B. Large Conformal Mask The so-called "large window method" is to enlarge the copper window to be about 1 mil larger than the blind hole on one side. В общем, if the aperture is 6 mils, это большое окно может быть открыто в 8 милях. Our company uses this method for operation.

4. The laser drilling blind buried hole operation process is explained with 1+2+1 as an example

Production process: open material----open large copper window----drill L2~L3 buried hole-----remove slag ------electroplating buried hole------resin plug hole- ----Inner layer graphics-----Pressing ------L1-2&L4-3 layer Large Windows (copper window is 1mil larger than the blind hole diameter on one side) (etching)------- L1-2&L4-3 layer laser drilling blind hole-------Remove the slag twice-------Plating blind hole (pulse plating)------Resin plug hole----- - Grinding board + copper reduction------ mechanical drilling through hole --- normal process 2+4+2 process opening - L3~6 layer graphics - pressing - opening large copper window - L23&L76 layer Laser Buried hole-L26 mechanical drilling-Desmear-Plating buried hole-Resin plug hole-----L2, L7 layer pattern-Pressing-Open large copper window-L12&L87 layer Laser-Desmear----- Blind electroplating hole-----resin plug hole----grinding board + copper reduction----mechanical drilling----normal process