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PCB Material List

PCB Material List - Teflon ceramic dielectric substrate TF-1/2

PCB Material List

PCB Material List - Teflon ceramic dielectric substrate TF-1/2

Teflon ceramic dielectric substrate TF-1/2

TF-1/2 is a kind of circuit laminate based on the Teflon PCB(which have excellent microwave and temperature resistance performance)compound with ceramic. This kind of laminate can be comparable with the products(such as RT/duroid 6006/6010/TMM10)from Rogers Corporation in United State of America.


The advantage of design for Microwave Circuit. using TF-1/2 here:

(1)The operating temperature is much higher than TP-series. It is applicable to long-term operation within temperature ranger of -80 degree Celsius~+200 degree Celsius,and can be used for wave-welding and melt-back welding.

(2)Used for the manufacturing of the Microwave Circuit. and millimeter wave printed circuit board .

(3)Better radiation performance,30min20rad/cm2.

(4)Dielectric property is stable and has a slight variation with the rise of temperature and frequency.(εr=3.0;6.0;9.2;9.6;10.2;16;20;22)

Technical Specifications:

Appearance

Dimension(mm)

Mechanical Strength

Chemical Property

Electrical Property

Meet the general requirement for laminate of microwave PCB.

150*150 250*250

Thickness and tolerance are same as TP-series. For special dimension,customized laminates is available.

Peel strength

≥ 8N/cm

Warp

Same as TP-series.

Cutting/punching

Strength

No burrs after cutting,minimum space between two punching holes is 0.55mm.

According to the properties of laminate,the chemical etching method for PCB can be used. The dielectric properties of laminate are not changed. The plating through hole can be done.

Name

Test condition

Unit

Value

Density

Normal state

g/ cm3

2.0~3.5

Moisture Absorption

Dip in the distilled water of 20±2 degree Celsius for24 hours

%

≤0.02

Operating Temperature

High-low temperature chamber

degree Celsius

-80 degree Celsius~+260 degree Celsius

Thermal Conductivity


W/m/k

0.5

CTE

-55~288 degree Celsius

ppm/ degree Celsius

50(x)

50(y)

60(z)

Shrinkage Factor

2 hours in boiling water

%

0.0001

Surface Resistivity

500V

DC

Normal state

M·Ω

≥1*105

Constant humidity and temperature

≥1*103

Volume Resistivity

Normal state

MΩ.cm

≥1*105

Constant humidity and temperature

≥1*104

Pin Resistance

500VDC

Normal state

≥1*106

Constant humidity and temperature

≥1*104

Surface dielectric strength

Normal state

d=1mm(Kv/mm)

≥1.6

Constant humidity and temperature

≥1.4

Dielectric Constant

10GHZ

εr

3.0;6.0;9.2 ;9.6 ;10.2;16;20;22 (±2%)(can be customized)

Dissipation Factor

10GHZ

tgδ(3~11)

≤1*10-3

tgδ(12~22)

≤1.5*10-3



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If you need TF-1/2 microwave radio frequency PCB, click here High frequency PCB