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F4T-1/2 is a kind of circuit baseplate based on the insulative teflon PCB, which is compressed with electrolytic copper foil (after oxidation treatment ) on both sides, and then pressed together after high-temperature and high pressure treatment. This product is characterized by excellent electrical performance (i.e. low dielectric constant, low loss) and ideal mechanical strength, which is a good choice for baseplate of Microwave PCB.
F4T-1/2 Technical Specifications
Appearance | Meet the general requirements for baseplate of microwave PCB | |||||
Dimensions(mm) | 150*150 220*160 250*250 200*300 | |||||
For special dimensions, customized lamination is available. | ||||||
Thickness and tolerance | 0.5±0.05 1±0.1 1.5±0.15 2±0.2 3±0.3 | |||||
Plate thickness includes the copper thickness. For special dimensions, customized lamination is available. | ||||||
Mechanical properties | Angularity | 0.02mm/mm for double-layer board | ||||
Cutting/ punching property | No burrs after cutting, and the minimum space between two punching holes is 0.55mm.
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Peel strength | In normal state:≥18N/cm; In the environment of constant humidity and temperature:≥6 N/cm . | |||||
Chemical properties | The chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed. | |||||
Electrical properties | Names | Test conditions | Unit | Specifications | ||
Gravity | Normal state | g/cm3 | 2.2～2.3 | |||
Water absorption rate | Dip in distilled water of 20±2 degree Celsius for 24 hours. | % | ≤0.01 | |||
Operating temperature | high-low temperature chamber | degree Celsius | -100～+150 | |||
Thermal conductivity coefficient | Kcal /m .h. degree Celsius | 0.4 | ||||
Coefficient of thermal expansion | Temperature rise of 96 degree Celsius per hour | *1 | 9.8～10*10-5 | |||
Shrinkage factor | Two hours in boiling water | % | 0.0005 | |||
Surface insulation resistance | 500V DC | Normal state | M.Ω | ≥1*107 | ||
Constant humidity and temperature | ≥1*105 | |||||
volume resistance | Normal state | MΩ.cm | ≥1*1010 | |||
Constant humidity and temperature | ≥1*107 | |||||
Pin resistance | 500V DC | Normal state | MΩ | ≥1*105 | ||
Constant humidity and temperature | ≥1*105 | |||||
Surface dielectric strength | Normal state | δ=1mm(kV/mm) | ≥1.5 | |||
Constant humidity and temperature | ≥1.4 | |||||
Permittivity | 10GHZ | εr | 2. 2.2(±2%) | |||
Dielectric loss angle tangent | 10GHZ | tgδ | ≤1*10-3 | |||
