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TU-872 LK and TU-87P LK are PCB materials with low Dk/Df and high thermal reliability. TU-872 LK is based on high-performance modified epoxy resin FR-4. This PCB material is reinforced with ordinary woven E glass, and is designed to have low dielectric constant and low loss factor, suitable for high-speed low-loss multilayer PCB and high-frequency multilayer PCB board applications. TU-872 LK PCB material is suitable for environmentally friendly lead-free process and is also compatible with FR-4 process. TU-872 LK multilayer PCB material also exhibits excellent CTE, excellent chemical resistance, thermal stability, CAF resistance, and toughness enhanced by compounds forming an allyl network.
TU-872 LK and TU-87P LK are PCB materials
TU-872 LK and TU-87P LK Industry Approvals, IPC-4101E Type Designation : /29, /99, /101, /126, IPC-4101E/126 Validation Services QPL Certified, UL designation - ANSI Grade: FR-4.0, UL file number: E189572, Flammability rating: 94V-0, Maximum Operating Temperature: 130°C
TU-872 LK and TU-87P LK Standard Availability, Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form, Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides, Prepregs: Available in roll or panel form, Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request
