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TU-768 High Speed Digital (HSD) PCB Materials
High Speed Digital (HSD)
TU-768
High-Tg and High Thermal Reliability Laminate and Prepreg
Core: TU-768; Prepreg: TU-768P
TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.
Main Applications
Consumer Electronics
Server, workstation
Automotive
Key Features
Lead Free process compatible
Excellent coefficient of thermal expansion
Anti-CAF property
Superior chemical and thermal resistance
Fluorescence for AOI
Moisture resistance
Property | Typical Values |
Tg (DMA) | 190°C |
Tg (DSC) | 180°C |
Tg (TMA) | 170°C |
Td (TGA) | 340°C |
CTE z-axis (50 to 260 °C) | 2.7% |
T-260/ T288 | >60 min/ >15 min |
Permittivity @1GHz(RC 50%) | 4.3 |
Loss Tangent @1GHz(RC 50%) | 0.018 |
Industry Approvals
IPC-4101E Type Designation : /98, /99, /101, /126
IPC-4101E/126 Validation Services QPL Certified
UL Designation - ANSI Grade: FR-4.0
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/8 to 12oz (HTE) for built-up; 1/8 to 3oz (HTE) for double sides and H to 2oz (MLS)
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628 etc.
