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IC Substrate

Double-side Printed Circuit Board (PCB)

IC Substrate

Double-side Printed Circuit Board (PCB)

Double-side Printed Circuit Board (PCB)

Model :  Double-side Printed Circuit Board (PCB) 

Material :  KB-6160C

Layer :  2Layers

Color :  Green/White

Substrate copper thickness : 1OZ

Finished copper thickness : 1.5OZ

Finished Thickness :  1.6mm

Surface Treatment :  Immersion gold(ENIG)

Application :  Consumer Electronics

Product Details Data Sheet

This is a mass production Double-side Printed Circuit Board (PCB) that is maturely produced by ipcb. We provide customers with low-cost PCBs and allow customers' products to occupy the market.


Double-sided Printed Circuit Board (PCB) is a very important type of PCB. There are double-sided circuit board metal base Printed Circuit Board (PCB) on the market, Hi-Tg heavy copper foil Printed Circuit Board (PCB), flat winding High-frequency double-sided Printed Circuit Board (PCB), high-frequency Printed Circuit Board (PCB), hybrid dielectric base high-frequency double-sided Printed Circuit Board (PCB), etc. It is suitable for a wide range of high-tech industries such as: telecommunications, power supply, Computers, industrial control, digital products, scientific and educational equipment, medical equipment, automobiles, aerospace, etc.


Double-sided PCB Craft

Double-sided Printed Circuit Board (PCB) is usually made of epoxy glass cloth copper clad board. It is mainly used for communication electronic equipment, advanced instruments and electronic computers with high performance requirements.

The production process of Double-sided Printed Circuit Board (PCB) is generally divided into process wire method, hole blocking method, masking method and pattern plating-etching method. The process flow of pattern plating-etching method is shown in the figure.

Printed Circuit Board (PCB) production process

Printed Circuit Board (PCB) production process

Double-sided PCB Proofing

Double-sided Printed Circuit Board (PCB) proofing, the most commonly used is craftsmanship. At the same time, rosin process, OSP process, gold plating process, immersion gold and silver plating processes are also applicable in Double-sided Printed Circuit Board (PCB).

Spray tin process: good appearance, the pad is silver-white, the pad is easy to tin, solder is easy, and the price is low.

Sikkim process: stable quality, usually used in the case of bonding IC.


The difference between a double-sided PCB and single-sided PCB

The difference between a double-sided Printed Circuit Board (PCB) and a single-sided Printed Circuit Board (PCB) is that the circuit of the single-sided Printed Circuit Board (PCB) is only on one side of the PCB, while the double-sided Printed Circuit Board (PCB) The circuit can be on both sides of the PCB board, with vias in the middle to connect the double-sided PCB circuit.

Parameters of Double-sided Printed Circuit Board (PCB) The production of double-sided Printed Circuit Board (PCB) is different from that of single-sided Printed Circuit Board (PCB). In addition to the production process, there is also an additional copper sinking process, that is, double-sided The process of circuit conduction.

Model :  Double-side Printed Circuit Board (PCB) 

Material :  KB-6160C

Layer :  2Layers

Color :  Green/White

Substrate copper thickness : 1OZ

Finished copper thickness : 1.5OZ

Finished Thickness :  1.6mm

Surface Treatment :  Immersion gold(ENIG)

Application :  Consumer Electronics


For PCB technical problems, iPCB knowledgeable support team is here to help you with every step. You can also request PCB quotation here. Please contact E-mail sales@ipcb.com

We will respond very quickly.