6layer Resin Plug PCB

In recent years, the thickness of the resin layer is more and more popular in the PCB industry, especially in the process of more and more holes. People hope to use resin plug to solve a series of problems that can not be solved by using green oil plug or pressing resin. However, due to the characteristics of the resin used in this process, many difficulties need to be overcome in order to obtain good quality of resin plug products.

In the PCB industry, many process methods have been widely used in the industry, and people are not concerned about the origin of some process methods. In fact, as early as when the spherical matrix array of electronic chips was just on the market, people had been giving advice for this kind of small chip mounting components, hoping to reduce the size of the finished products from the structure.

In the 1990s, a Japanese company developed a kind of resin to plug the hole directly, and then copper plating on the surface, mainly to solve the problem of air blowing in the air which is easy to occur in the green oil plug hole. Intel applied this process to Intel's electronic products, and the so-called pofv (via on pad) process was born.

3. Application of resin plug hole:

At present, the technology of resin plug hole is mainly used in the following products:

3.1 resin plug hole of pofv technology.

3.1.1 technical principle

A. The through hole is plugged with resin, and then copper plated on the surface of the hole.

3.1.2 advantages of pofv Technology

l. Reduce the distance between holes and the area of the plate,

l. Solve the problem of wire and wiring, improve the wiring density.

3.2 inner layer HDI resin plug hole

3.2.1 technical principle

Plug the buried hole of inner HDI with resin, and then press it. This process balances the contradiction between the thickness control of the pressed medium layer and the design of the inner HDI buried hole glue filling.

l. If the inner HDI buried hole is not filled with resin, the board will burst and be scrapped directly in case of overheated impact;

l. If the resin plug hole is not used, multiple PP sheets are required to be pressed to meet the needs of glue filling. However, the thickness of the medium layer between layers will be thicker due to the increase of PP sheet.

3.2.3 application of inner HDI resin plug hole

l. The inner HDI resin plug is widely used in HDI products to meet the design requirements of thin dielectric layer of HDI products;

l. For the blind buried products with buried hole design of inner HDI, the process of inner HDI resin plug hole often needs to be increased because the medium design of the intermediate combination is too thin.

l. Because the thickness of blind hole layer of some blind hole products is greater than 0.5mm, the blind hole can not be filled by pressing filling glue, and resin plug hole is also needed to fill the blind hole, so as to avoid the problem of no copper in the blind hole in the follow-up process.

3.3 through hole resin plug

In some 3G products, because the thickness of the board is more than 3.2mm, in order to improve the reliability of the product, or to improve the reliability problem caused by the green oil plug hole, people also use resin to plug the through-hole under the permission of cost. This is a major product category which has been popularized in recent years.